Cuk Integrated Magnetics Converter with Current Ripples Cancellation

Hampton, 2:00 PM

Abstract: The Cuk Converter with Integrated Magnetics is analyzed and compared to an equivalent Flyback Converter operating at the same frequency. A simple Cuk model is provided for easy simulation. The comparison reveals that the Cuk converter is inferior to the equivalent Flyback Converter and the “Optimal Power Conversion Topology” narrative is an illusion.

Speaker Bio: Isaac Cohen (BSEE ‘73, Technion, Israel, MSM ’85, NY Polytechnic) has over 40 years' experience in Power Electronics and is a retired Senior Member of both Texas Instruments Technical Staff and the IEEE. He is holder of numerous Power Electronics patents and has several more pending. As a Retired Principal System Architect for the TI’s HV converters and Controllers business unit in Manchester, NH. he was responsible for development of power architectures and control algorithms for low and medium power AC-DC conversion.

Multi-phase Power Measurements with an Oscilloscope

Boardroom, 2:00 PM

Abstract: Multi-phase power measurements are critical in applications such as multi-phase buck converters and three-phase power systems, including motor drives and inverters. While power analyzers are commonly employed in these settings, they typically provide a static view of the system, which may not capture the dynamic behavior of the signals involved. This presentation explores the advantages of using oscilloscopes for multi-phase power measurements, enabling a more comprehensive analysis of transient phenomena. Also reviewed is the fundamental principles of power measurements on oscilloscopes and the challenges posed by signal irregularities. A live demonstration illustrates the process of making a three-phase power measurement on a motor drive inverter output, showcasing how oscilloscopes can effectively capture and analyze dynamic states. Attendees will gain insights into leveraging oscilloscopes for enhanced power measurement techniques, ultimately improving their understanding of multi-phase systems and applications.

Speaker Bio: Chris Ball joined Rohde & Schwarz in 2023, bringing with him nearly two decades of experience in the test and measurement industry. Since beginning his career in 2006, he has held diverse roles spanning service, manufacturing, product support, sales, and management. He holds a BS in Electrical Engineering from Portland State University and an AAS in Electronic Systems from Idaho State University.

High Efficiency and Density Using New Generation Semiconductor Packaging

Brookhaven, 2:00 PM

Abstract: As power electronics evolve to meet the demands of higher efficiency, thermal performance and compact system design, packaging technologies continue to play a critical role in enabling next-generation solutions. This presentation explores the advantages and implementation of wettable flank packaging in power semiconductor devices, particularly in automotive and industrial applications. Wettable flanks enable reliable optical solder joint inspection in surface-mount assemblies and address the major challenge in meeting automotive quality control and zero-defect initiatives. Comparative data is presented to show how this technology leads to improvements in manufacturability, automated optical inspection (AOI), long-term mechanical integrity and enhances PCB’s electrical performance. Finally, the session shows how the work done on wettable flank technology in support of the stringent requirements of AEC-Q100/101 automotive standards, makes it ideal as an alternate source for designs in other high-reliability market segments.

Speaker Bio: Kevin Parmenter is director of field applications engineering for Taiwan Semiconductor, North America. With over 40 years of experience in the electronics and semiconductor industry, his expertise encompasses technology marketing, applications engineering, product definition, and spans design engineering for the medical electronics and military electronics fields. He has a BSEE from Purdue University and a BA in Business Administration from Colorado Technical University. Kevin is an IEEE Senior member, holds a First Class FCC license and an Amateur Extra Class license (call sign KG5Q).

Getting the Most from LTspice 24.1

Hampton, 3:00 PM

Abstract: LTspice® is a powerful, fast, and free SPICE simulator software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits. Its graphical schematic capture interface allows probing schematics to produce simulation results, which can be explored further through the built-in waveform viewer. Also covered are the library of macromodels and demo circuits while illustrating how LTspice’s enhancements improve the simulation of analog circuits.

Speaker Bio: Bill Geosits is a Field Applications Engineer with the Analog Devices Global Broad Market team. Bill holds a BSEE and MBA from Lehigh University and has been an Applications Engineer since 1992. Bill supports customers in the Mid-Atlantic and Upstate New York areas and is primarily involved in power and analog applications.

Switch-Mode Power Converter Compensation Made Easy

Boardroom, 3:00 PM

Abstract: Compensation requires some research to do correctly. This talk will break the procedure down into a step-by-step process that you can follow to compensate a power converter. We will explain the theory of compensation and why it is necessary, examine various power stages, and show how to determine where to place the poles and zeros of the compensation network to compensate a power converter. We will examine typical error amplifiers as well as transconductance amplifiers to see how each affects the control loop and work through a number of topologies/examples so that power engineers have a quick reference when they need to compensate a power converter.

Speaker Bio: Louis Diana is an Analog Field Applications engineer for TI since 2004. He has more than 40 years of design experience. Before joining TI, he designed power systems for space satellites. Lou has a BSEE from New York Institute of Technology, and 90% of a MSEE from New York Polytechnic University. He presented numerous design seminars, and conference papers and is a holder of one US patent

AC Sources for Test & Measurement

Brookhaven, 3:00 PM

Abstract: A review of how AC sources are different than the programmable DC sources. From the specifications and expectations – they are very different with not-trivial challenges.

Speaker Bio: Paul Moore is the Product Manager for TDK-Lambda’s Genesys AC power product line, supporting marketing, applications, and customer needs across the Americas. He earned his BE in Electrical Engineering from the University of Delaware in 1995 and has built a career that blends technical expertise with customer-facing experience.

Gan Efficiency and Reliability at 125 C

Hampton, 4:00 PM

Abstract: Temperature-related questions often come up when designing power supplies. One topic is how GaN FET vs. silicon MOSFET characteristics influence the power supply design for a given maximum junction design temperature, which is often chosen as 125 degrees C. How do the loss factors change from 25 C to 125 C, and are there differences between various GaN FETs? Next, another topic: how is the reliability of GaN FETs when running at the power supply FETs’ maximum junction temperature? Are there reliability concerns that point toward running at a lower temperature for continuous operation, or is continuous operation at 125 degrees C not a reliability concern?

Speaker Bio: Brian Miller joined EPC in 2016, where he is senior field applications engineer for eastern North America. He has over 30 years of experience in power electronics, as a design engineer and as a field application engineer. At IBM and Sony Ericsson, he designed small, efficient power supplies and battery chargers, and designed a custom analog controller IC for notebook DC-DC and battery charging. Previous to EPC, Brian was a field application engineer for Semtech, where he was involved in designs for DC-DC, AC-DC, LED lighting, TVS, and other areas. He has authored patents, articles, and talks. Brian received his MSE and BS degrees from Duke University in Durham, N. Carolina.

Leading Edge Power Magnetics Design

Boardroom, 4:00 PM

Abstract: Magnetic components are central to power electronics, influencing cost, efficiency, and reliability. This work presents a multi-physical, multi-objective design methodology that considers electrical, thermal, and economic requirements in an integrated way. Finite element simulations combined with Latin-hypercube sampling enabled a systematic sensitivity study across core aspect ratio, winding geometry, potting, and cooling interfaces. Simplified models reduced simulation effort by a factor of 50 while maintaining accuracy. Output metrics included temperature, losses, mass, and cost. Results are presented as correlations and Pareto fronts, allowing informed trade-offs between performance and cost. This methodology offers engineers a structured path to design optimized magnetic components that balance efficiency, thermal limits, and economic viability for advanced power electronic systems.

Speaker Bio: Glenn Burnham holds a BSEE from Northeastern University and an MBA from the University of Massachusetts. He has over 25 years of experience in wireless semiconductor test and currently supports customers with all of Yageo's products.

HSC topology in High Performance AI Power Systems

Brookhaven, 4:00 PM

Abstract: The requirements for power systems that support high-performance AI computing infrastructure with 40 V to 60 V inputs are becoming increasingly challenging. Higher efficiency and power-density requirements are changing rapidly, and the thermal environment is becoming more difficult to manage. Power must be delivered closer to the point-of-load, and intermediate bus voltages require flexibility to achieve the best overall efficiency and transient response. The presentation includes how adding a multi-tapped autotransformer to the super-efficient ZVS switched-capacitor topology creates the Hybrid Switched-Capacitor (HSC) topology and enables additional flexibility in conversion ratios without increasing the number of cells or the number of power switches Additional system benefits — such as a novel startup scheme, simple droop current sharing, and the ability to synchronize multiple stages — will be shown.

Speaker Bio: Chris R. Swartz is a Senior Member of the IEEE with more than 36 years of experience in power electronics design. He began his career at Motorola, where he worked on both digital and power electronics during a ten-year tenure there. Chris then spent 14 years at Emerson Network Power designing both fully custom and standard AC–DC and DC–DC products. Chris subsequently worked for two years at Transim Technology, focusing on advanced power electronics and thermal simulation, before embarking on a 16-year career with Vicor as a Senior Principal Engineer. Then Chris joined Infineon as a Lead Principal Engineer

Understanding Battery Cell Key Parameters and the Challenges to Measure Them

Hampton, 5:00 PM

Abstract: This tutorial presentation is for engineers who are selecting and applying cells when developing battery-powered electronic products and systems. By understanding the definition and measurement challenges of the key battery cell parameters, engineers will be able to make better choices for which kinds of batteries to use by understanding the meaning behind each cell parameters and how they may impact their device design. The properly measurement of parameter and interpretation of results are covered including Open Circuit Voltage, Self-Discharge, AC Internal Resistance, DC Internal Resistance, and Capacity.

Speaker Bio: Bob Zollo started at Hewlett-Packard in 1984. During his 42 years with HP, Agilent, and now Keysight, Bob has been part of the company’s marketing and R & D organizations for power supplies, electronic loads, power analyzers, data acquisition equipment, test systems and test software. As a solution architect, Bob is responsible to create Keysight’s grid power and battery testing solutions roadmap by researching customer and industry trends and developing plans to meet emerging customer needs. He was product manager for several generations of power supplies, including the first modular power system introduced by HP in 1989. He has also managed Agilent’s power supply test systems business, wireless power business, and battery test systems business. Bob holds a degree in Electrical Engineering from Stevens Institute of Technology.

Maximizing On-Product Warnings

Boardroom, 5:00 PM

Abstract: “Failure to warn” and “inadequate warnings” continue to top today’s product liability allegations. An overview of the ANSI Z535.4 and ISO 3864-2 standards and how they can be used as the foundation for effective labels and instructions. Also reviewed is why safety labels are important, how they fit into a systems approach to safety (risk assessments, safety labeling, and instruction manuals). The session includes a discussion on the most recent updates to the relevant standards – including ANSI Z535.4, ANSI Z535.7, and ISO 3864-2. Also discussed will be warnings considerations related to translations, “wordless” or graphic-based format options, and digitalization and automation.

Speaker Bio: Angela Lambert has over two decades of experience in product safety, warnings, and liability. In her role at Clarion Safety, she collaborates with manufacturers – as well as industry partners and advocates – on labels, signs and markings that can help reduce risk and protect people. From a standards perspective, Ms. Lambert is actively involved at the leadership level in the ANSI and ISO standards for product safety. She is chair of the ANSI Z535.1 subcommittee, leading the standard that focuses on colors used in visual safety communication. She is a member of the ANSI Z535.7 subcommittee, part of a small group of experts championed the development of this new standard, leading to its publication in late 2024. She is also a delegate representative to the ANSI Z535 committee, to the ISO/TC 145 SC2 WG 1 committee, and to ISO/TC 283. Additionally, she is the liaison for ISO/TC 145 to ISO/TC 283.

Integrated Power Module Development

Brookhaven, 5:00 PM

Abstract: Activities at the Spellman High Voltage Laboratory at Stony Brook University are highlighted with a focus on a recent Integrated Power Module showing the design framework and the design challenges, considerations and optimization. This includes a detailed investigation of the thermal design and power losses followed by module fabrication and test results.

Speaker Bio: Yang Li is a student at Stony Brook University and works on the development of power electronics circuitry and analysis at the Spellman High Voltage Power Electronics Laboratory at SBU. He was published in several journals and in conference proceedings. His current work at SBU is under the direction of Dr. Fang Lou, director of the Spellman High Voltage Power electronics Lab at SBU.